Plasma Technology Systems, LLC (PTS) provide vacuum and atmospheric plasma gas development services and manufacture plasma equipment for molecular re-engineering of surfaces. Services include:
The PTS team have been developing surfaces for customers for over 30 years. As an alternative to purchasing equipment, PTS offer onsite process development and contract services for our customers. For onsite processing, the PTS equipment resources include low pressure systems for treating materials from as small as powders up to 60 inch wide textiles and films. Atmospheric processes include Openair® activation and the PlasmaPlus® deposition processes.
Low pressure (vacuum) process development and contract service offerings include:
| Atomic-level cleaning |
| Ablation/Etching |
| Activation/Functionalization |
| Plasma Enhanced Chemical Vapor Deposition (PECVD) |
| Crosslinking |
| Grafting |
PlasmaPlus® atmospheric processes performed by PTS for its customers include:
| Activation/Functionalization |
| Plasma Enhanced Chemical Vapor Deposition (PECVD) |
And Openair® >atmospheric processes include:
| Atomic-level cleaning |
| Ablation/Etching |
| Activation/Functionalization |
These services are conducted in one of three labs at the Belmont facility, to include a Class 1000 clean room. Validation tools include:
| Surface energy measurements via contact angle and/or Dyne-cm fluids. |
| Ellipsometry measurements to determine film thickness and index of refraction. |
| Discounted surface analytical services such as XPS, FTIR, AFM are easily coordinated with our partners. |
Please contact us for more information on these services.
|
